Methods of utilizing a back to back semiconductor device module

ABSTRACT

A back-to-back semiconductor device module includes two semiconductor devices, the backs of which are secured to one another. Each bond pad of both semiconductor devices is disposed adjacent a single, mutual edge of the module. The module may be oriented nonparallel to a carrier substrate and secured to the carrier substrate directly or indirectly thereto. A module-securing device for indirectly securing the module to the carrier substrate may include an alignment device with one or more receptacles formed therein and intermediate conductive elements that are disposed within the receptacles to establish electrical connections between the bond pads of the semiconductor devices and corresponding terminals of the carrier substrate. Alternatively, a clip-on lead, one end of which resiliently biases against a lead of at least one of the semiconductor devices, the other end of which is electrically connected to a terminal of the carrier substrate, may be employed as a module-securing device.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of application Ser. No. 09/407,333,filed Sep. 29, 1999, now U.S. Pat. No. 6,417,024, issued Jul. 9, 2002,which is a divisional of application Ser. No. 09/052,197, filed Mar. 31,1998, now U.S. Pat. No. 6,147,411, issued Nov. 14, 2000.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to multi-chip modules and, morespecifically, to multi-chip modules including semiconductor devices thatare mounted to one another in a back-to-back relationship. The presentinvention also relates to chip-on-board assemblies. Particularly, thepresent invention relates to bare and minimally packaged semiconductordevices which are mountable substantially perpendicularly to a carriersubstrate such as a printed circuit board. All of the bond pads of thesemiconductor devices are disposed proximate a single edge or sidethereof. The present invention also relates to methods and devices forsecuring back-to-back mounted semiconductor devices perpendicularlyrelative to a carrier substrate and for establishing electricalconnections between the semiconductor devices and the carrier substrateto fabricate a multi-chip module.

2. Background of Related Art

The direct attachment of an unpackaged semiconductor device to a circuitboard is known in the art as chip-on-board technology. Semiconductordevices that are directly (i.e., without packaging) mountable to acircuit board typically include peripherally disposed bond pads that areadjacent more than one edge thereof or in an area array over the activesurface of the semiconductor device. Methods for attaching unpackaged orminimally packaged (such as the so-called “chip scale package”)semiconductor devices directly to a circuit board include wire bonding,flip-chip technology and tape automated bonding. Typically, when suchtechniques are employed, a semiconductor device (typically a singulatedsemiconductor die) which includes bond pads on an active surface thereofis oriented over the circuit board, either active surface up or activesurface down, and substantially parallel thereto, in order to establishan electrical connection between the semiconductor device and thecircuit board by one of the aforementioned techniques. Afterelectrically connecting such a semiconductor device to a circuit board,a protective coating may be applied over the semiconductor device.

However, the active surface-down placement of a semiconductor devicedirectly against a circuit board is somewhat undesirable in that, due tothe substantially parallel orientation of the semiconductor devicerelative to the circuit board and the location of an integrated circuiton the active surface of the semiconductor device against the circuitboard, heat must pass through the circuit board or through the substrateof the semiconductor device in order to dissipate from the activesurface of the semiconductor device. Thus, the transfer of heat awayfrom the semiconductor device is relatively slow and may result in thegeneration of damaging ambient temperatures at the active surface duringprolonged operation of the semiconductor device. A horizontal (parallel)orientation of the semiconductor device relative to the circuit boardalso causes the semiconductor device to consume a great deal of area or“real estate” on the circuit board. Moreover, conventional chip-on-boardattachments as previously referenced are typically permanent, makingthem somewhat undesirable from the standpoint that they are not readilyuser-upgradable by substitution of different, higher-performancesemiconductor devices.

Various multi-chip module arrangements have been developed to conserve“real estate” on a carrier substrate. Some multi-chip modules include aplurality of mutually parallel bare semiconductor devices that aresecured in a stack, one above another. The semiconductor devices ofstacked multi-chip modules are typically substantially parallel to thecarrier substrate to which they are secured. Multi-chip modules withvertically oriented dice are also known. Exemplary device stackarrangements are described in the following U.S. Pat. No. 5,291,061,issued to Ball on Mar. 1, 1994; and U.S. Pat. No. 5,323,060 issued toFogal et al. on Jun. 21, 1994. Exemplary vertical dice arrangements aredescribed in U.S. Pat. No. 5,362,986, issued to Angiulli et al. on Nov.8, 1994; and U.S. Pat. No. 5,397,747, issued to Angiulli et al. on Mar.14, 1995.

While multi-chip modules successfully conserve some of the “real estate”on a carrier substrate, the horizontal (i.e., substantially parallel tothe carrier substrate) orientation of some such devices still consumes asignificant area thereof. Moreover, the stacking of many suchsemiconductor devices inhibits the dissipation of heat from the devicesof the stack, which may, as noted above, adversely affect theperformance of the semiconductor devices, and may even damage them.Finally, many known multi-chip modules are electrically connected to acarrier substrate with solder or other permanent means, such as wirebonds or TAB (tape automated bonding or flex circuit) connections, andare also permanently mechanically attached by solder, epoxy or anotherbonding agent. Thus, such semiconductor devices are not readilyremovable from the carrier substrate or readily replaceable thereupon(i.e., they are not user-upgradable).

Similarly, vertical surface mount packages are known in the art. Whencompared with traditional, horizontally mountable semiconductor packagesand chip-on-board devices, many vertical surface mount packages have asuperior ability to transfer heat away from the semiconductor device dueto exposure of both major surfaces of the package. Vertical surfacemount packages also consume less area on a circuit board than ahorizontally mounted package of the same size. Thus, many skilledindividuals in the semiconductor industry are finding vertical surfacemount packages more desirable than their traditional, horizontallymountable counterparts. The following United States patents disclosevarious exemplary vertical surface mount packages: Re. 34,794, issued toWarren M. Farnworth on Nov. 22, 1994; U.S. Pat. No. 5,444,304, issued toKouija Hara and Jun Tanabe on Aug. 22, 1995; U.S. Pat. No. 5,450,289,issued to Yooung D. Kweon and Min C. An on Sep. 12, 1995; U.S. Pat. No.5,451,815, issued to Norio Taniguchi et al. on Sep. 19, 1995; U.S. Pat.No. 5,592,019, issued to Tetsuya Ueda et al. on Jan. 7, 1997; and U.S.Pat. No. 5,635,760, issued to Toru Ishikawa on Jun. 3, 1997.

Many vertical surface mount packages are somewhat undesirable in thatthey include leads which operatively connect a semiconductor device to acircuit board. The leads of such devices tend to increase the impedanceand decrease the overall speed with which such devices conductelectrical signals. Moreover, the required packaging of many suchdevices adds to their undesirability. Typically, packaging requiresmultiple additional materials and manufacturing steps, which translateinto increased production costs, which are further increased due to thepotential for package and connection defects and resulting lower finalyields. The packaging of many vertical surface mount packages, and thusthickness in excess of that of the packaged die, also tends to consumeadditional area or “real estate” on the circuit board to which they areattached. Further, the materials of most semiconductor device packagestend to inhibit the transfer of heat from the semiconductor devicecontained therein. Moreover, many vertical surface mount packages arenot readily user-upgradable due to permanent connections to the carriersubstrate.

Accordingly, the inventor has recognized a need for a semiconductordevice configuration that has low impedance, provides improved heattransfer and conserves “real estate” on a carrier substrate. There isalso a need for user-upgradable semiconductor devices, which isaddressed by some embodiments of the invention.

SUMMARY OF THE INVENTION

The back-to-back semiconductor device module according to the presentinvention addresses each of foregoing needs.

The back-to-back semiconductor device module of the present inventionincludes two semiconductor devices, each having a plurality of bond padsdisposed proximate a single edge thereof. The back surfaces, or bases,of the adjoined semiconductor devices are bonded together with anadhesive material to form the back-to-back semiconductor device module.The bond pads of each semiconductor device are positioned adjacent amutual or common edge of the semiconductor device module.

The present invention also includes methods and devices for securing theback-to-back semiconductor device module substantially perpendicularrelative to a carrier substrate.

An embodiment of a method for securing the module substantiallyperpendicular to a carrier substrate employs the disposition of solderbricks on the terminals of the carrier substrate that correspond to thelocations of the bond pads of the semiconductor devices of the moduleand the use of solder reflow techniques to establish an electricallyconductive joint therebetween.

An embodiment of a module-securing element that orients the modulesubstantially perpendicular to the carrier substrate comprises analignment device including one or more receptacles having a plurality ofintermediate conductive elements therein. Upon insertion of the moduleinto the socket, the intermediate conductive elements establish anelectrical connection between bond pads of each of the semiconductordevices and their corresponding terminals or traces on the carriersubstrate.

Another embodiment of a module-securing element for orienting the modulesubstantially perpendicularly relative to a carrier substrate includes aleaf spring clip-on lead that establishes a biased, interference-typeelectrical connection with a bond pad on at least one of thesemiconductor devices and a conductive extension which may beelectrically connected to a corresponding terminal or trace on thecarrier substrate.

The present invention also includes assemblies wherein the back-to-backsemiconductor device module of the present invention is orientedsubstantially perpendicular to a carrier substrate with conductivejoints, with an alignment device, with clip-on leads, or with anotherelectrically conductive element. An electronic system with which theback-to-back semiconductor device module is associated is also withinthe scope of the present invention.

Advantages of the present invention will become apparent to those ofordinary skill in the art through a consideration of the appendeddrawings and the ensuing description.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 is a perspective view of a back-to-back semiconductor devicemodule according to the present invention;

FIG. 2 is a frontal perspective view of a semiconductor device that isuseful in the back-to-back semiconductor device module of FIG. 1;

FIGS. 3 a and 3 b are side plan views that illustrate a method ofsecuring the back-to-back semiconductor device module of FIG. 1 to acarrier substrate with support joints;

FIG. 3 c is a side plan view which illustrates a variation of thesupport joints of FIGS. 3 a and 3 b;

FIG. 4 is a side plan view depicting the use of support joints inconnection with the module-carrier substrate assembly formed by themethod of FIG. 3;

FIG. 5 is a perspective view of an embodiment of a module-securingdevice according to the present invention;

FIG. 6 a is a perspective view of a variation of the module-securingdevice illustrated in FIG. 5;

FIG. 6 b is a perspective view of another variation of themodule-securing device illustrated in FIG. 5;

FIG. 7 is a cross-section taken along line 7—7 of FIG. 6 a, depicting anassembly including the back-to-back semiconductor device module of FIG.1, the module-securing device of FIG. 6 a and a carrier substrate, andillustrating the biasing of the intermediate conductive elements againstbond pads of the semiconductor devices;

FIGS. 8 a and 8 b are perspective views illustrating covers that may beused on the module-securing device depicted in FIGS. 6 a and 6 b;

FIGS. 9 a and 9 b are perspective views which depict variations of themodule-securing device of FIGS. 6 a and 6 b;

FIG. 10 a is a side plan view of another embodiment of a module-securingdevice according to the present invention, showing a module engagedthereby and connection to a carrier substrate;

FIG. 10 b is a frontal plan view of a variation of the embodiment ofFIG. 10 a;

FIG. 10 c is a side plan view of the variation shown in FIG. 10 b; and

FIG. 11 is a schematic representation of an electronic system whichincludes the back-to-back semiconductor device module of FIG. 1.

DETAILED DESCRIPTION OF THE INVENTION

With reference to FIG. 1, a back-to-back semiconductor device module 10,sometimes termed a “module” for simplicity, includes a firstsemiconductor device 12 a, a second semiconductor device 12 b, and anintervening securing element 13. Semiconductor devices 12 a and 12 b mayeach comprise a semiconductor die. Module 10 secures to a carriersubstrate (not shown), such as a printed circuit board (PCB), in asubstantially perpendicular orientation and electrically connectsthereto. Module 10 may be secured directly to the carrier substrate 40with conductive joints 20 (see FIGS. 3 b and 4), inserted into analignment device 50 (see FIG. 5), or electrically attached to clip-onleads 85 that are secured to terminals 42 of the carrier substrate (seeFIG. 10 a).

Referring to FIG. 2, each semiconductor device 12 a, 12 b (each of whichis also referred to herein as a semiconductor device 12) is generally ofa type known in the industry, and includes circuit traces and associatedactive elements carried on an active surface 18 thereof, which tracesand elements are typically collectively referred to as integratedcircuitry. Semiconductor device 12 a includes bond pads 14 a, 14 b, 14c, etc. that are disposed on an active surface 18 of the same,electrically connected with the integrated circuitry thereof, andlocated adjacent a single peripheral edge 15 thereof. Preferably, bondpads 14 a, 14 b, 14 c, etc. are arranged in-line, parallel to theadjacent edge and substantially equally spaced therefrom. Bond pads 14may be disposed a short distance from edge 15, or their lower edges maybe flush with the edge. Thus, during fabrication of semiconductor device12 a, bond pads 14 a, 14 b, 14 c, etc. are redirected, for use in theinvention by an additional step or steps, to a location which isproximate edge 15 if the bond pad layout of semiconductor device 12 adoes not already suitably locate the bond pads. Processes which areknown to those of ordinary skill in the art are useful for fabricatingmodified semiconductor devices 12 that are useful in the module 10according to the present invention. Such processes include the formationof input and output circuit traces which lead from original, centralbond pad locations to edge 15 and rerouted bond pads 14 adjacent edge15. Preferably, the fabrication steps which precede the formation of theinput/output circuit traces that lead to bond pads 14 and the formationof the bond pads are unchanged from their equivalent steps in thefabrication of prior art semiconductor devices. Thus, existingsemiconductor designs are useful in the assembly of the presentinvention with little or no modification.

A preferred semiconductor device 12 has a standardized number of bondpads 14 a, 14 b, 14 c, etc., which are spaced laterally from one anotherat a standardized space or “pitch,” and which may be positioned at aspecific location relative to a center line 16 of the semiconductordevice, or relative to any other landmark on the semiconductor device,such as a peripheral side thereof. Alternatively, the spacing and numberof bond pads 14 may be non-standardized. The placement of bond pads 14proximate edge 15 imparts semiconductor device module 10 with reducedimpedance as the bond pads are electrically connected to a carriersubstrate (not shown) via very short, large cross-section conductiveelements, relative to many vertical surface mount packages and otherpackaged semiconductor devices in the prior art.

Referring again to FIG. 1, securing element 13 is disposed betweensemiconductor devices 12 a and 12 b to secure them to one another in aback-to-back configuration. Securing element 13 may include conductiveor non-conductive epoxies, a thin layer polymeric film having anadhesive coating on its upper and lower surfaces (such as the adhesivepolyimide film sold under the trade name KAPTON™ by E.I. du Pont deNemours & Co. of Wilmington, Del.), room temperature vulcanizing (RTV)silicones, or other adhesive materials known in the art. Preferably,semiconductor devices 12 a and 12 b are secured together such that theirbond pads 14 are proximate a mutual, or common, edge 11 of module 10.Semiconductor devices 12 a and 12 b may be secured together while eachis in wafer form on separate wafers placed back-to-back, then severedthrough the depth of both wafers. Alternatively, semiconductor devices12 a and 12 b may be secured together after the semiconductor wafershave been severed to singulate the devices. It should be noted that theinvention may be practiced with partial wafers including more than onedie location thereon.

Referring now to FIGS. 3 a and 3 b, a method of direct electricalattachment of the back-to-back semiconductor device module 10 of thepresent invention includes the use of conductive joints to secure thesemiconductor devices 12 a and 12 b to a carrier substrate 40 andestablish an electrical connection between the corresponding substrateand the semiconductor devices. Preferably, as shown in FIG. 3 a, thebond pads 14 of each semiconductor device 12 a and 12 b may each includea bump 17 formed thereon. Bumps 17 are preferably formed from gold, goldalloy, or solder by techniques which are known in the art.

With continued reference to FIG. 3 a, a brick or pellet of solder paste32 is disposed on each terminal 42 of carrier substrate 40. Typically,solder paste 32 is a mixture of solder powder, flux and a binder whichkeeps the solder powder and flux together. The preferred solder paste 32and bump 17 materials have matched impedance to ensure optimumconditions for the transfer of electrical signals from carrier substrate40 to semiconductor devices 12 a and 12 b and from the semiconductordevices to the carrier substrate. Preferably, solder paste 32 is appliedto terminals 42 by techniques which are known in the art, includingwithout limitation screen printing, stencil printing, pressuredispensing, and the use of solder preforms.

As module 10 is positioned on carrier substrate 40, each bump 17contacts a brick of solder paste 32. Bump 17 and solder paste 32 arethen fused together to form a solder joint, which is also referred to asa module-securing element or a module-securing device, as anelectrically conductive joint or as a conductive joint 20. Referring toFIG. 3 b, conductive joint 20 physically supports module 10 relative tocarrier substrate 40 in a substantially perpendicular orientation withrespect thereto, and electrically connects bond pads 14 to theircorresponding terminals 42. Preferably, known solder reflow techniquesare employed to form conductive joint 20. Solder reflow techniquesinclude, but are not limited to, vapor-phase, infrared, hot gas, andother solder reflow methods. Other known soldering techniques may alsobe useful for fusing bump 17 and solder paste 32 to electrically connectbond pad 14 to terminal 42. Alternatively, as shown in FIG. 3 c, aconductive joint 20′ may be formed by placing a connector ofelectrically conductive or conductor-filled epoxy or any otherconductive element, including without limitation electrically conductiveanisotropic (so-called z-axis) elastomers, in contact with both bond pad14 and terminal 42′. Terminal 42′ includes an upwardly extendingcomponent 43′ so that an electrical connection may be established withbond pad 14 by a z-axis elastomer which includes conductors that runparallel to carrier substrate 40.

Referring now to FIG. 4, one or more non-conductive support joints 34,which are also referred to as support footings or support members, maybe placed along edge 11 between conductive joints 20, and between module10 and carrier substrate 40 to impart additional structural stability tothe module. Alternatively, a continuous bead of such material may beapplied over all conductive joints 20 for enhanced support andenvironmental protection. Preferably, support joints 34 are formed frommaterials such as epoxy potting compounds, acrylic compounds, siliconematerials, resinous molding compounds, or other polymeric plasticmaterials which are known in the art. Preferably, the amount of materialthat is used to form each support joint 34 is sufficient to supportmodule 10, yet minimal in order to optimize the transfer of heat awayfrom semiconductor devices 12 a and 12 b and preserve surface area (or“real estate”) on carrier substrate 40.

Alternatively, as shown in FIG. 5, module 10 (see FIG. 1) may be securedto carrier substrate 40 with another embodiment of a module-securingdevice, which is referred to as an alignment device 50. Alignment device50 may comprise a base 52 and side walls 55 that define one or morereceptacles 54 therebetween, extending substantially downward from thetop of the alignment device to carrier substrate 40. Side walls 55facilitate the proper alignment of module 10 as it is inserted intoreceptacle 54. Preferably, base 52 is fixedly mounted to carriersubstrate 40 with protrusions which extend into or through the carriersubstrate, adhesives, epoxies, solders, or other substrate attachmentcomponents and processes known in the art. As shown in broken lines inFIG. 5, alignment device 50 may include cut-out side walls 55 a definingside edge slots to receive and align module 10 while facilitating heattransfer away from the exterior active surfaces of semiconductor devices12 a and 12 b.

FIGS. 6 a and 7 illustrate a variation of alignment device 50′ whichincludes a plurality of receptacles 54. Receptacles 54 each include twosides 56 and 57 and two ends 58 and 59. Preferably, in embodiments ofalignment device 50′ which include more than one receptacle 54 a, 54 b,54 c, etc., each of the receptacles is arranged in a mutually parallelrelationship, such that side 57 a of one receptacle 54 a is adjacent toside 56 b of the next receptacle 54 b. Preferably, sides 56 and 57 areslightly longer than the width of the module 10 (see FIG. 1) that is tobe inserted therein. Similarly, ends 58 and 59 are slightly wider thanthe overall thickness of module 10. Thus, the lengths of sides 56, 57and ends 58, 59 facilitate insertion of module 10 into receptacle 54 andremoval of the same from the receptacle by providing clearance betweenthe module and the sides and ends of the receptacle. Each receptacle 54also has an upper end 60, which opens to the top surface 53 of alignmentdevice 50, and a lower end 61. Module 10 (see FIG. 1) inserts intoreceptacle 54 through upper end 60.

Referring now to FIG. 6 b, each receptacle 54′ may also include analignment mechanism 70. A preferred embodiment of alignment mechanism 70includes guide slots 71 and 72, formed within ends 58′ and 59′,respectively. Guide slots 71 and 72 may extend from the upper end ofreceptacle 54′ and at least partially down ends 58′ and 59′,respectively. Guide slots 71 and 72 are adapted to engage acorresponding edge of the module 10 (edges 73 and 74, respectively,shown in FIG. 1).

Two rows of upwardly extending intermediate conductive elements 62 a and62 b (which are also referred to herein as conductive elements 62), eachrow including one or more intermediate conductive elements 62, aredisposed within lower end 61 of receptacle 54. FIG. 7 illustrates apreferred embodiment of an intermediate conductive element 62. Eachintermediate conductive element 62 is a leaf spring which extendsthrough base 52 of alignment device 50 to connect to a correspondingterminal 42 of carrier substrate 40. Intermediate conductive element 62includes a terminal contact end 63, a bond pad contact end 64, and aspring arm 65 adjoining the terminal contact end 63 and the bond padcontact end 64. Preferably, terminal contact end 63, spring arm 65 andbond pad contact end 64 are formed integrally with one another. Eachterminal contact end 63 is electrically connected to a correspondingterminal 42 associated with a trace on carrier substrate 40. During theinsertion of a module 10 (see FIG. 1) into receptacle 54, spring arm 65is forced away from the module. The reactive (i.e., spring) force ofspring arm 65 resiliently biases bond pad contact end 64 against itscorresponding bond pad 14 (see FIG. 1) in order to establish anelectrical connection therewith. Thus, intermediate conductive element62 establishes an electrical connection between carrier substrate 40 andone of the semiconductor devices 12 a, 12 b of module 10.

Preferably, bond pad contact end 64 is bent in an arcuate slope with aconvex, inwardly-facing surface to form an outward extension 66. Outwardextension 66 facilitates movement of bond pad contact end 64 as a module10 (see FIG. 1) is inserted into receptacle 54. The shape of outwardextension 66 may also prevent damage to the semiconductor devices 12 aand 12 b and their bond pads 14 during insertion of module 10 intoreceptacle 54.

Preferably, alignment device 50 is manufactured from a material whichmaintains its shape and rigidity at the relatively high temperaturesthat may be generated during the operation of a semiconductor device. Amaterial which has good thermal conductivity properties and which may beformed into thin layers is also preferable. Materials including, withoutlimitation, ceramics, glasses, and low electrostatic discharge (ESD)injection molded plastics are useful for manufacturing alignment device50.

Referring again to FIG. 6 b, sides 56 and 57 of alignment device 50 mayalso be slotted or otherwise perforated to form apertures 75, as shownin broken lines, which enhance the transfer of heat from semiconductordevices 12 that are disposed within receptacles 54.

With reference to FIGS. 8 a and 8 b, alignment device 50 may alsoinclude a cover 80. Preferably, cover 80 is a removable member whichprevents dust and debris from entering receptacles 54 (see FIG. 5) ofalignment device 50 and contaminating semiconductor devices 12 a and 12b (see FIG. 1). FIG. 8 b depicts a cover 80′ which includes a finnedheat sink 82′ extending from its top surface to facilitate the transferof heat away from the semiconductor devices and the alignment device.

Although embodiments of alignment device 50 which include a plurality ofreceptacles that completely receive a module 10 (see FIG. 1) have beendepicted, other embodiments of the alignment device are also within thescope of the invention. FIGS. 9 a and 9 b illustrate some variations ofthe alignment device that are useful for securing the back-to-backsemiconductor device module of the present invention in a substantiallyperpendicular orientation relative to a carrier substrate.

FIG. 9 a depicts another variation of the alignment device 150, thereceptacles 154 of which only receive a bottom portion of each module 10(see FIG. 1), and secure only bottom edge 11 of the same. FIG. 9 b showsyet another variation of the alignment device 150′, wherein thereceptacles 154′ are arranged in a matrix-type arrangement (i.e., incolumns and rows). Alignment devices including combinations of thesefeatures, as well as alignment devices with other features and withcombinations of the above and other features, are to be consideredwithin the scope of the present invention.

Referring again to FIG. 7, as an example of the interconnection ofmodule 10 and alignment device 50, module 10 is inserted into receptacle54 through upper end 60. Side walls 55 ensure the proper alignment ofbond pads 14 (see FIG. 1) with their corresponding intermediateconductive elements 62. As module 10 is inserted into receptacle 54,bond pads 14 are abutted by their respective intermediate conductiveelements 62, creating a resiliently-biased, electrically conductiveinterference-type connection between semiconductor devices 12 a and 12 band carrier substrate 40. A cover 80 (see FIGS. 8 a and 8 b) may then bedisposed over alignment device 50.

FIG. 10 a shows another embodiment of a module-securing device, which isreferred to as a clip-on lead 85. Clip-on lead 85 includes a bond padcontact end 86 and a terminal contact end 90. Bond pad contact end 86includes two upwardly extending leaf springs 87, 88 which are joined bya cross-member 89. Leaf springs 87 and 88 are laterally spaced so as topermit the insertion of a module 10 therebetween. Upon insertion ofmodule 10 between leaf springs 87, 88, one or both of the leaf springsare resiliently biased against a corresponding bond pad 14 ofsemiconductor devices 12 a, 12 b, respectively, establishing aninterference-type electrical contact therewith. Such an arrangement isparticularly suitable when employed with identically functional butmirror-imaged semiconductor devices 12 a and 12 b, so that some commoninputs or outputs may be shared to a single pair of connected leafsprings 87 and 88.

In most instances, however, a leaf spring 87 will be electricallyisolated from an associated leaf spring 88, such as by mounting toopposing sides of a common base. FIGS. 10 b and 10 c illustrate such avariation of clip-on lead 85′, wherein mirror-imaged leaf springs 87′and 88′ are attached to and electrically insulated from one another by abase 95′. Each leaf spring 87′, 88′ includes a bond pad contact end 97′,98′, respectively, and a terminal contact end 99′, 100′, respectively.Bond pad contact ends 97′ and 98′ are laterally spaced so as to permitthe insertion of a module 10 therebetween. Upon insertion of module 10between leaf springs 87′ and 88′, one or both of the bond pad contactends 97′, 98′ are resiliently biased against a corresponding bond pad 14of semiconductor devices 12 a, 12 b, respectively, establishing aninterference-type electrical contact therewith.

Terminal contact ends 99′ and 100′ are each electrically attachable toterminal 42 a, 42 b of carrier substrate 40. Such an electricalconnection may be established by solder, conductive epoxy, z-axis film,or any other electrically conductive bonding agent known in the art.Upon connection of module 10 with clip-on lead 85′, an electricalconnection is established between semiconductor device(s) 12 a, 12 b,terminal(s) 42 a, 42 b, and any external device(s) electricallyconnected thereto. Preferably, the clip-on leads 85′ which are securedto module 10 orient the module substantially perpendicularly relative tocarrier substrate 40.

FIG. 11 illustrates an electronic system 300, such as a computer, whichincludes a carrier substrate 302. Module 10 is secured to carriersubstrate 302 and each of the semiconductor devices 12 a and 12 bthereof is electrically connected to the carrier substrate. Thus, module10 and its semiconductor devices 12 a and 12 b are operativelyassociated with electronic system 300.

Advantageously, the bond pads of the module, which are disposed adjacenta single, mutual peripheral edge thereof, may be electrically connectedto corresponding terminals on a carrier substrate with very shortconductive elements exhibiting low impedance. Thus, the additionalimpedance that is typically generated by package leads or longelectrical traces carried on the semiconductor device is significantlyreduced. The placement of bond pads on the module also facilitates thesubstantially perpendicular securing of the module to a carriersubstrate, which, when combined with a convection-type air circulationsystem, facilitates heat transfer away from the module.

Because the back-to-back semiconductor device module is bare orminimally packaged, the space consumption thereof relative to verticalsurface mount packages, horizontally mountable semiconductor devices andpackages, and many other multi-chip modules is reduced. Further,fabrication of the semiconductor devices requires no substantialadditional steps relative to the fabrication of many similarsemiconductor devices in the prior art. Assemblies including theinventive back-to-back semiconductor device module and an alignmentdevice or a clip-on lead are also user-upgradable.

Although the foregoing description contains many specificities, theseshould not be construed as limiting the scope of the present invention,but merely as providing illustrations of some of the presently preferredembodiments. Similarly, other embodiments of the invention may bedevised which do not depart from the spirit or scope of the presentinvention. The scope of this invention is, therefore, indicated andlimited only by the appended claims and their legal equivalents, ratherthan by the foregoing description. All additions, deletions andmodifications to the invention as disclosed herein which fall within themeaning and scope of the claims are to be embraced within their scope.

1. A method of nonhorizontally securing semiconductor devices to a carrier, comprising: providing at least one module including a first semiconductor device having a first back side that is secured to a second back side of a second semiconductor device; providing a carrier with a support member thereon; orienting the at least one module nonhorizontally relative to the carrier with the support member so that bond pads on the first and second semiconductor devices correspond with terminals of the carrier; establishing an electrical connection between the bond pads and the corresponding terminals.
 2. The method of claim 1, wherein providing the carrier comprises providing the carrier with the support member oriented nonhorizontally to the carrier.
 3. The method of claim 2, wherein orienting the at least one module comprises aligning the at least one module with a receptacle defined at least partially by the support member.
 4. The method of claim 1, wherein establishing comprises supporting the at least one module in a receptacle defined at least partially by the support member.
 5. The method of claim 1, wherein providing the carrier comprises providing the carrier with the support member at least partially defining a plurality of receptacles.
 6. The method of claim 5, wherein providing the carrier comprises providing the carrier with the plurality of receptacles oriented nonhorizontally to the carrier.
 7. The method of claim 5, further comprising at least partially inserting at least one module into each receptacle of the plurality of receptacles.
 8. The method of claim 1, wherein providing the carrier comprises providing a carrier with intermediate conductive elements that electrically communicate with the terminals of the carrier.
 9. The method of claim 8, wherein establishing comprises resiliently engaging at least one bond pad of a semiconductor device of the at least one module with the intermediate conductive elements to establish communication between the at least one bond pad and a corresponding terminal.
 10. A method of nonhorizontally securing semiconductor devices to a carrier, comprising: providing at least one module including a first semiconductor device having a first back side that is secured to a second back side of a second semiconductor device; providing a carrier having a support member thereon, the support member at least partially defining at least one receptacle; and inserting the at least one module into the at least one receptacle with the at least one module oriented nonhorizontally relative to the carrier, and so that at least one bond pad of at least one of the first and second semiconductor devices is in electrical communication with terminals of the carrier.
 11. The method of claim 10, wherein providing the carrier comprises providing the carrier with the at least one receptacle oriented nonhorizontally relative to the carrier.
 12. The method of claim 10, wherein providing the carrier comprises providing a carrier with at least one intermediate conductive element that communicates electrically with a corresponding terminal of the carrier.
 13. The method of claim 12, wherein inserting comprises resiliently engaging at least one bond pad of a semiconductor device of the at least one module with the at least one intermediate conductive element to establish communication between the at least one bond pad and a corresponding terminal of the carrier. 